Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method

Coefficient of thermal expansion (CTE) mismatch between the different material layers in the substrate leads to residual warpage and stresses. Such deformation adds additional mechanical constraints to solder joint attached on the surface of substrate and subsequently leads to solder joint reliabili...

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Main Author:	Pang, Hooi San
Format:	Thesis
Language:	English
Published:	2007
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/id/eprint/9444/1/PangHooiSanMFKM2007.pdf
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id	my-utm-ep.9444
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spelling	my-utm-ep.94442018-08-29T07:51:12Z Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method 2007-04 Pang, Hooi San TJ Mechanical engineering and machinery Coefficient of thermal expansion (CTE) mismatch between the different material layers in the substrate leads to residual warpage and stresses. Such deformation adds additional mechanical constraints to solder joint attached on the surface of substrate and subsequently leads to solder joint reliability issue of the electronic package. Thus, a new composite material was evaluated with the aim to reduce both in-plane and out-of-plane CTE of the core substrate. In this study, equivalent thermo-mechanical and viscoelastic properties of silica-filled epoxy were predicted with finite element method. The silica-filled epoxy was served as the matrix of the core substrate and woven glass were embedded as few layers in the matrix phase. Viscoelastic response of the matrix phase and resulting orthotropic of the multilayered substrate were modeled. Substrate warps in concave shape after subjected to curing temperature due to CTE mismatch and asymmetry of geometry. For surface mount assembly, accumulated inelastic strain in the critical solder joint with low CTE composite substrate is lower than that of with conventional FR-4 substrate during the solder reflow and temperature cycles. In addition, the predicted life cycle of the low CTE composite assembly is 36.9 % longer compared to assembly with FR-4 substrate. 2007-04 Thesis http://eprints.utm.my/id/eprint/9444/ http://eprints.utm.my/id/eprint/9444/1/PangHooiSanMFKM2007.pdf application/pdf en public http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:675?site_name=Restricted Repository masters Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering
institution	Universiti Teknologi Malaysia
collection	UTM Institutional Repository
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Pang, Hooi San Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method
description	Coefficient of thermal expansion (CTE) mismatch between the different material layers in the substrate leads to residual warpage and stresses. Such deformation adds additional mechanical constraints to solder joint attached on the surface of substrate and subsequently leads to solder joint reliability issue of the electronic package. Thus, a new composite material was evaluated with the aim to reduce both in-plane and out-of-plane CTE of the core substrate. In this study, equivalent thermo-mechanical and viscoelastic properties of silica-filled epoxy were predicted with finite element method. The silica-filled epoxy was served as the matrix of the core substrate and woven glass were embedded as few layers in the matrix phase. Viscoelastic response of the matrix phase and resulting orthotropic of the multilayered substrate were modeled. Substrate warps in concave shape after subjected to curing temperature due to CTE mismatch and asymmetry of geometry. For surface mount assembly, accumulated inelastic strain in the critical solder joint with low CTE composite substrate is lower than that of with conventional FR-4 substrate during the solder reflow and temperature cycles. In addition, the predicted life cycle of the low CTE composite assembly is 36.9 % longer compared to assembly with FR-4 substrate.
format	Thesis
qualification_level	Master's degree
author	Pang, Hooi San
author_facet	Pang, Hooi San
author_sort	Pang, Hooi San
title	Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method
title_short	Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method
title_full	Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method
title_fullStr	Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method
title_full_unstemmed	Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method
title_sort	development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method
granting_institution	Universiti Teknologi Malaysia, Faculty of Mechanical Engineering
granting_department	Faculty of Mechanical Engineering
publishDate	2007
url	http://eprints.utm.my/id/eprint/9444/1/PangHooiSanMFKM2007.pdf
_version_	1747814732604112896

Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method

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