Etching performance of silicon wafers with redesigned etching drum

Etching process involves various chemical reactions and reflects significantly on silicon wafer quality. This master project addresses the major problem on wafers during etching that is wafer removal distribution throughout etching drum compartment. The etching drum has been redesigned to overcome t...

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Main Author:	Dolah, Rozzeta
Format:	Thesis
Language:	English
Published:	2006
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/id/eprint/9445/1/RozzetaDolahFKM2005.pdf
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spelling	my-utm-ep.94452018-09-17T03:35:32Z Etching performance of silicon wafers with redesigned etching drum 2006-06 Dolah, Rozzeta TJ Mechanical engineering and machinery Etching process involves various chemical reactions and reflects significantly on silicon wafer quality. This master project addresses the major problem on wafers during etching that is wafer removal distribution throughout etching drum compartment. The etching drum has been redesigned to overcome the lower removal problem at the end of each compartment. The characteristics of the end wafers are compared with other wafers in the compartment to study the etching difference that leads to this problem. Etching parameters are then evaluated in order to optimize the etching process in conjunction with the use of this new drum. For optimization purpose is by applying Design of Experiment (DOE) with full factorial design is employed. Etching factors namely the bubbling flow rate, wafer rotation, and etchant temperature had been varied in 11 runs in the DOE. The responses studied etching removal, total thickness variation (TTV) and wafer brightness. It is found that etchant temperature gives major a impact on all three responses stated above. The etchant temperature is the main effect factor and significantly affects TTV. Additionally, the etchant temperature and bubbling flow rate provide interaction effect on both the etching removal and wafer brightness. A higher bubbling flow rate is required to ensure etching removal and brightness within specification. Besides studying these three responses, the wafer surface after etching is additionally analyzed using ADE Infotool software which captures the etched profile and its thickness. From the ADE result, it again indicates that a higher temperature contributes to a more concave shape of etched wafer, thus resulting in higher TTV sending the wafers to be out of specification. Finally, the optimum condition is tested on a final run utilizing all the four compartments. The uniformity without lower removal at the end compartment is observed in removal distribution graph. The new drum design performance is enhanced with the optimized value of bubbling flow rate, etchant temperature and wafer rotation to achieve the best removal distribution. 2006-06 Thesis http://eprints.utm.my/id/eprint/9445/ http://eprints.utm.my/id/eprint/9445/1/RozzetaDolahFKM2005.pdf application/pdf en public http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:690?site_name=Restricted Repository masters Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering
institution	Universiti Teknologi Malaysia
collection	UTM Institutional Repository
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Dolah, Rozzeta Etching performance of silicon wafers with redesigned etching drum
description	Etching process involves various chemical reactions and reflects significantly on silicon wafer quality. This master project addresses the major problem on wafers during etching that is wafer removal distribution throughout etching drum compartment. The etching drum has been redesigned to overcome the lower removal problem at the end of each compartment. The characteristics of the end wafers are compared with other wafers in the compartment to study the etching difference that leads to this problem. Etching parameters are then evaluated in order to optimize the etching process in conjunction with the use of this new drum. For optimization purpose is by applying Design of Experiment (DOE) with full factorial design is employed. Etching factors namely the bubbling flow rate, wafer rotation, and etchant temperature had been varied in 11 runs in the DOE. The responses studied etching removal, total thickness variation (TTV) and wafer brightness. It is found that etchant temperature gives major a impact on all three responses stated above. The etchant temperature is the main effect factor and significantly affects TTV. Additionally, the etchant temperature and bubbling flow rate provide interaction effect on both the etching removal and wafer brightness. A higher bubbling flow rate is required to ensure etching removal and brightness within specification. Besides studying these three responses, the wafer surface after etching is additionally analyzed using ADE Infotool software which captures the etched profile and its thickness. From the ADE result, it again indicates that a higher temperature contributes to a more concave shape of etched wafer, thus resulting in higher TTV sending the wafers to be out of specification. Finally, the optimum condition is tested on a final run utilizing all the four compartments. The uniformity without lower removal at the end compartment is observed in removal distribution graph. The new drum design performance is enhanced with the optimized value of bubbling flow rate, etchant temperature and wafer rotation to achieve the best removal distribution.
format	Thesis
qualification_level	Master's degree
author	Dolah, Rozzeta
author_facet	Dolah, Rozzeta
author_sort	Dolah, Rozzeta
title	Etching performance of silicon wafers with redesigned etching drum
title_short	Etching performance of silicon wafers with redesigned etching drum
title_full	Etching performance of silicon wafers with redesigned etching drum
title_fullStr	Etching performance of silicon wafers with redesigned etching drum
title_full_unstemmed	Etching performance of silicon wafers with redesigned etching drum
title_sort	etching performance of silicon wafers with redesigned etching drum
granting_institution	Universiti Teknologi Malaysia, Faculty of Mechanical Engineering
granting_department	Faculty of Mechanical Engineering
publishDate	2006
url	http://eprints.utm.my/id/eprint/9445/1/RozzetaDolahFKM2005.pdf
_version_	1747814732845285376

Etching performance of silicon wafers with redesigned etching drum

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