Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly
In the rapid growth of the semiconductor industry, subcontractors are highly competitive to gain their market segment and sustain the business. The ability to meet the shipment commits is critical, often gated by the process cycle time. Increasing challenges arise with high product customization in...
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| Format: | Thesis |
| Language: | eng eng eng |
| Published: |
2024
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| Online Access: | https://etd.uum.edu.my/10989/1/depositpermission-s900375.pdf https://etd.uum.edu.my/10989/2/s900375_01.pdf https://etd.uum.edu.my/10989/3/s900375_02.pdf |
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