Wire sweep characteristics of multi-tier palladium-copper wire bonding on low quad flat package with low alpha green mold compound /
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| Format: | Thesis Book |
| Language: | English |
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| LEADER | 01428cam a2200337 i 4500 | ||
|---|---|---|---|
| 001 | u1005513 | ||
| 003 | SIRSI | ||
| 005 | 201410161026 | ||
| 008 | 141016s2014 my a t 000 0 eng m | ||
| 040 | |a UMM |d UMJ |e rda | ||
| 090 | |a TJ7 |b UM 2014 Sitssa | ||
| 097 | |a TJ7 |b UM 2014 Sitssa | ||
| 100 | 0 | |a Siti Sofiyah Skh Ali, |e author | |
| 245 | 1 | 0 | |a Wire sweep characteristics of multi-tier palladium-copper wire bonding on low quad flat package with low alpha green mold compound / |c Siti Sofiyah binti Skh Ali. |
| 264 | 1 | |c 2014. | |
| 264 | 4 | |c 2014. | |
| 300 | |a xv, 113 leaves : |b illustrations ; |c 30cm. | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 502 | |b M.Sc. |c Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya |d 2014. | ||
| 504 | |a Bibliography: leaves 88-93. | ||
| 650 | 0 | |a Semiconductor industry. | |
| 650 | 0 | |a Drags (Hydrography). | |
| 650 | 0 | |a Wire. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik, |e degree granting institution. | |
| 900 | |a MZAR-ZA | ||
| 596 | |a 1 7 | ||
| 999 | |a TJ7 UM 2014 SITSSA |w LC |c 1 |i A516155539 |d 16/3/2015 |f 16/3/2015 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 16/3/2015 | ||
| 999 | |a TJ7 UM 2014 SITSSA |w LC |c 2 |i A516157177 |d 16/3/2015 |f 16/3/2015 |g 1 |l COUNTER |m P07JURUTER |r N |s Y |t CD |u 16/3/2015 | ||
| 999 | |a TJ7 UM 2014 SITSSA |w LC |c 1 |i A516051220 |d 11/5/2015 |f 11/5/2015 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 28/4/2015 | ||