Ghosh, S. K. (2015). Effects of metallic nanoparticle doped flux on morphology and growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and copper substrate.
Chicago Style (17th ed.) CitationGhosh, Sujan Kumer. Effects of Metallic Nanoparticle Doped Flux on Morphology and Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Copper Substrate. 2015.
MLA (8th ed.) CitationGhosh, Sujan Kumer. Effects of Metallic Nanoparticle Doped Flux on Morphology and Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Copper Substrate. 2015.
Warning: These citations may not always be 100% accurate.