Electromigration damage in lead-free solder joints prepared using metallic nanoparticle doped flux /
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| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
2017.
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| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/8112/ |
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| LEADER | 01409cam a2200337 i 4500 | ||
|---|---|---|---|
| 001 | u1069063 | ||
| 003 | SIRSI | ||
| 005 | 201711201044 | ||
| 008 | 171120s2017 my a m 000 0 eng | ||
| 040 | |a UMJ |d UMM |e rda | ||
| 090 | |a TJ7 |b UMP 2017 Nas | ||
| 097 | |a TJ7 |b UMP 2017 Nas | ||
| 100 | 1 | |a Nasir, Muhammad, |e author. | |
| 245 | 1 | 0 | |a Electromigration damage in lead-free solder joints prepared using metallic nanoparticle doped flux / |c Muhammad Nasir. |
| 264 | 1 | |c 2017. | |
| 300 | |a xx, 136 leaves : |b illustrations ; |c 30 cm. | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 502 | |b Ph.D. |c Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya |d 2017. | ||
| 504 | |a Bibliography: leaves 122-135. | ||
| 650 | 0 | |a Electrodiffusion. | |
| 650 | 0 | |a Integrated circuits |x Defects. | |
| 650 | 0 | |a Nanoparticles. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik, |e degree granting institution. | |
| 856 | 4 | 1 | |u http://studentsrepo.um.edu.my/8112/ |
| 596 | |a 1 7 25 | ||
| 900 | |a NSR NSM | ||
| 999 | |a TJ7 UMP 2017 NAS |w LC |c 1 |i A104138075 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 12/1/2018 |1 STEM | ||
| 999 | |a TJ7 UMP 2017 NAS |w LC |c 1 |i A516963558 |d 17/1/2018 |f 17/1/2018 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 17/1/2018 |1 STEM | ||
| 999 | |a TJ7 UMP 2017 NAS |w LC |c 1 |i A517143523 |d 29/8/2018 |f 29/8/2018 |g 1 |l STACKS |m P25UMARCHI |r N |s Y |t CD |u 28/8/2018 |1 STEM | ||