Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys /
Saved in:
Main Author: | Loh, Hwei Ling (Author) |
---|---|
Format: | Thesis Book |
Language: | English |
Published: |
2019.
|
Subjects: | |
Online Access: | http://studentsrepo.um.edu.my/11498/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn /
by: Leong, Yee Mei
Published: (2020) - The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
-
Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
by: Nahavandi, Mahdi
Published: (2014) -
Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /
by: Dharma, I Gusti Bagus Budi -
Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7Cu lead-free solder alloy /
by: Jaffery, Syed Hassan Abbas
Published: (2017)