Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2020.
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| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/12151/ |
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| Physical Description: | 50 unnumbered leaves : illustrations ; 30 cm Also issued in CD |
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| Bibliography: | Bibliography: leaves [unnumbered leave 48-50] |