APA引文

Gurbinder Singh Gurmukh Singh. (2021). Effect of heating on bonding characteristics for copper wire bond technology.

Chicago Style (17th ed.) Citation

Gurbinder Singh Gurmukh Singh. Effect of Heating on Bonding Characteristics for Copper Wire Bond Technology. 2021.

MLA引文

Gurbinder Singh Gurmukh Singh. Effect of Heating on Bonding Characteristics for Copper Wire Bond Technology. 2021.

警告：这些引文格式不一定是100％准确.