Effect of heating on bonding characteristics for copper wire bond technology /
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| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
2021.
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| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/14263/ |
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|---|---|---|---|
| 001 | u1150995 | ||
| 003 | SIRSI | ||
| 005 | 202112070959 | ||
| 008 | 211207s2021 my a m 000 0 eng | ||
| 040 | |a UMM |d UMJ |d AUM |e rda | ||
| 090 | |a TJ7 |b UMP 2021 Gur | ||
| 097 | |a TJ7 |b UMP 2021 Gur | ||
| 100 | 0 | |a Gurbinder Singh Gurmukh Singh, |e author. | |
| 245 | 1 | 0 | |a Effect of heating on bonding characteristics for copper wire bond technology / |c Gurbinder Singh. |
| 264 | 1 | |c 2021. | |
| 300 | |a xvi, 121 leaves : |b colour illustrations ; |c 30 cm | ||
| 336 | |a text |2 rdacontent | ||
| 336 | |a still image |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 337 | |a computer |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 338 | |a computer disc |2 rdacarrier | ||
| 502 | |b Ph.D. |c Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya |d 2021. | ||
| 504 | |a Bibiliography: leaves 103-119. | ||
| 530 | |a Also issued in CD. | ||
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik, |e degree granting institution. | |
| 650 | 0 | |a Copper wire. | |
| 650 | 0 | |a Electric wire. | |
| 650 | 0 | |a Copper |x Thermal properties. | |
| 650 | 0 | |a Microelectronics. | |
| 856 | 4 | 1 | |u http://studentsrepo.um.edu.my/14263/ |
| 900 | |a NNANS US | ||
| 596 | |a 1 7 25 | ||
| 999 | |a TJ7 UMP 2021 GUR |w LC |c 1 |i A517719608 |f 14/3/2022 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 14/3/2022 |1 STEM | ||
| 999 | |a TJ7 UMP 2021 GUR |w LC |c 1 |i A517732771 |f 24/3/2022 |g 1 |l STACKS |m P07JURUTER |r Y |s Y |t TESIS |u 24/3/2022 |1 STEM | ||
| 999 | |a TJ7 UMP 2021 GUR |w LC |c 1 |i A517719599 |f 31/5/2022 |g 1 |l STACKS |m P25UMARCHI |r N |s Y |t CD |u 31/5/2022 |1 STEM |o .STAFF. MST-CD1791 | ||