Effect of heating on bonding characteristics for copper wire bond technology /

Effect of heating on bonding characteristics for copper wire bond technology /

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Bibliographic Details
Main Author:	Gurbinder Singh Gurmukh Singh (Author)
Format:	Thesis Book
Language:	English
Published:	2021.
Subjects:	Copper wire. Electric wire. Copper > Thermal properties. Microelectronics.
Online Access:	http://studentsrepo.um.edu.my/14263/
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