Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة كتاب |
| اللغة: | English |
| منشور في: |
2021.
|
| الموضوعات: | |
| الوصول للمادة أونلاين: | http://studentsrepo.um.edu.my/13581/ |
| الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
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| 003 | SIRSI | ||
| 005 | 202204081129 | ||
| 008 | 220408s2021 my a m 000 0 eng | ||
| 040 | |a UMM |e rda | ||
| 090 | |a TA7 |b UM 2021 Wak | ||
| 097 | |a TA7 |b UM 2021 Wak | ||
| 100 | 1 | |a Wakeel, Saif, |e author. | |
| 245 | 1 | 0 | |a Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package / |c Saif Wakeel. |
| 264 | 1 | |c 2021. | |
| 300 | |a xvi, 112 leaves : |b illustrations (some colour) ; |c 30 cm | ||
| 336 | |a text |2 rdacontent | ||
| 336 | |a still image |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 502 | |b M.Eng.Sc. |c Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya |d 2021. | ||
| 504 | |a Bibliography: leaves 93-111. | ||
| 650 | 0 | |a Electronic packaging |x Materials. | |
| 650 | 0 | |a Fine pitch technology. | |
| 650 | 0 | |a Solder and soldering. | |
| 650 | 0 | |a Surface mount technology. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik, |e degree granting institution. | |
| 856 | 4 | 1 | |u http://studentsrepo.um.edu.my/13581/ |
| 900 | |a NNANS US | ||
| 596 | |a 1 7 | ||
| 999 | |a TA7 UM 2021 WAK |w LC |c 1 |i A517727555 |f 13/6/2022 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 8/4/2022 |1 STEM |o .STAFF. TERIMA DARI P. KEJURUTERAAN TANPA CD & SURAT AGREEMENT. | ||
| 999 | |a TA7 UM 2021 WAK |w LC |c 1 |i A517747405 |l STACKS |m P07JURUTER |r Y |s Y |t TESIS |u 26/5/2022 |1 STEM |o .PUBLIC. CD kept in the Engineering library. | ||