Characterization of Sn-3.0Ag-0.5Cu/Cu solder joints by microwave hybrid heating with silicon wafer susceptor /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2022.
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| Subjects: | |
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| Physical Description: | xxiii, 175 leaves : colour illustrations ; 30 cm |
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| Bibliography: | Bibliography: leaves 161-173. |