Package cracking mechanism in plastic encapsulated integrated circuit devices /
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة كتاب |
| اللغة: | English |
| منشور في: |
1993.
|
| الموضوعات: | |
| الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
|
| LEADER | 00797cam a2200229 a 4500 | ||
|---|---|---|---|
| 001 | u346956 | ||
| 003 | SIRSI | ||
| 008 | 940127s1993 si v 00 1 eng m | ||
| 035 | |a ABR-8022 | ||
| 040 | |a UMM | ||
| 090 | |a TK7874 |b Tan | ||
| 100 | 1 | 0 | |a Tan, Geok Leong. |
| 245 | 1 | 0 | |a Package cracking mechanism in plastic encapsulated integrated circuit devices / |c by Tan Geok Leong. |
| 260 | |c 1993. | ||
| 300 | |a ix, 110 leaves : |b ill. (some col.) ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Eng.) -- National University of Singapore, 1993. | ||
| 504 | |a Bibliography: leaves 81-85. | ||
| 650 | 0 | |a Microelectronic packaging. | |
| 650 | 0 | |a Plastics in packaging |x Fracture. | |
| 948 | |a 27/01/1994 |b 20/08/2002 | ||
| 596 | |a 1 | ||
| 999 | |a TK7874 TAN |w LC |c 1 |i A504525071 |d 12/4/1995 |l STACKS |m P01UTAMA |n 1 |r Y |s Y |t TESIS |u 3/3/1994 | ||