Package cracking mechanism in plastic encapsulated integrated circuit devices /

مواد مشابهة

• Study of alternative packaging materials for semiconductor devices /
  بواسطة: Suprammaniam, Sugumar
  منشور في: (1997)
• Hygrothermally-induced delamination and cracking in plastic IC packages /
  بواسطة: Lin, Tingyu
  منشور في: (1999)
• Delamination propagation in plastic IC packages during solder reflow /
  بواسطة: Ma, Yiyi
  منشور في: (1999)
• Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages /
  بواسطة: Shutesh Krishnan
  منشور في: (2007)
• Development of non-post mold cure alternative for semiconductor packaging /
  بواسطة: Tan, Sook Wai
  منشور في: (1997)