Methodology of solder paste selection in semiconductor industry /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
1996.
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| Subjects: | |
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| LEADER | 01109cam a2200277 a 4500 | ||
|---|---|---|---|
| 001 | u399541 | ||
| 003 | SIRSI | ||
| 008 | 790926s1996 my a t 00 11 eng m | ||
| 035 | |a ACA-6930 | ||
| 040 | |a UMM | ||
| 090 | |a TK7871.15 |b S7Gov | ||
| 091 | |a Microfiche 12627. | ||
| 100 | 1 | 0 | |a Govindasamy, Subramaniam D. |
| 245 | 1 | 0 | |a Methodology of solder paste selection in semiconductor industry / |c by Subramaniam D. Govindasamy. |
| 260 | 0 | |c 1996. | |
| 300 | |a 121 leaves : |b ill. ; |c 30 cm. | ||
| 500 | |a Also available on microfiche. Kuala Lumpur : Perpustakaan Universiti Malaya, 1996. 2 fiches : negative ; 11x15 cm. | ||
| 502 | |a Dissertation (M.Tech. (Material Sc.)) -- Institut Pengajian Tinggi, Universiti Malaya, 1996. | ||
| 504 | |a Bibliography : leaves 109-113 | ||
| 650 | 0 | |a Solder pastes. | |
| 650 | 0 | |a Semiconductors. | |
| 710 | 2 | 0 | |a Universiti Malaya. |b Institut Pengajian Tinggi. |
| 948 | |a 20/07/1996 |b 25/09/2003 | ||
| 596 | |a 1 | ||
| 999 | |a TK7871.15 S7GOV |w LC |c 1 |i A505600013 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 22/7/1996 | ||
| 999 | |a TK7871.15 S7GOV |w LC |c 2 |i A506003783 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 27/9/1996 | ||