Reliability of wire bonding in micro electronic packaging /
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
1996.
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| LEADER | 01205cam a2200289 a 4500 | ||
|---|---|---|---|
| 001 | u404420 | ||
| 003 | SIRSI | ||
| 008 | 790926s1996 my a t 00 11 eng m | ||
| 035 | |a ACB-5995 | ||
| 040 | |a UMM | ||
| 090 | |a TK7874 |b Ghao | ||
| 091 | |a Microfiche 14920 | ||
| 100 | 0 | 0 | |a Ghazali Omar. |
| 245 | 1 | 0 | |a Reliability of wire bonding in micro electronic packaging / |c Ghazali bin Omar. |
| 260 | |c 1996. | ||
| 300 | |a iv, 144 leaves : |b ill., col. ; |c 30 cm. | ||
| 500 | |a Microfiche. Kuala Lumpur : University of Malaya Library, 2000. 2 fiches : negative ; 11 x 15 cm. | ||
| 502 | |a Dissertation (M.Tech. (Material Sc.)) -- Institut Pengajian Tinggi, Universiti Malaya, 1997. | ||
| 504 | |a Bibliography : leaves [128-129]. | ||
| 650 | 0 | |a Miniature electronic equipment |x Bonding |x Testing. | |
| 650 | 0 | |a Semiconductors |x Bonding |x Testing. | |
| 650 | 0 | |a Metal bonding |x Testing. | |
| 710 | 2 | 0 | |a Universiti Malaya. |b Institut Pengajian Tinggi. |
| 948 | |a 26/10/1996 |b 25/09/2003 | ||
| 596 | |a 1 | ||
| 999 | |a TK7874 GHAO |w LC |c 1 |i A505602164 |d 15/8/1997 |l B_KOM4 |m P01UTAMA |n 1 |r Y |s Y |t TESIS |u 1/11/1996 |o .PUBLIC. BKOM 4 : 42611 | ||
| 999 | |a TK7874 GHAO |w LC |c 2 |i A506426406 |d 14/8/2001 |l STACKS |m P01UTAMA |n 2 |r Y |s Y |t TESIS |u 28/12/1996 | ||