Material characterization of soft solder die attaches for power ICs /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
1996.
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| Subjects: | |
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| Item Description: | Microfiche. Kuala Lumpur : University of Malaya Library, 2000. 2 fiches : negative ; 11 x 15 cm. |
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| Physical Description: | vii, 118 leaves : ill., col. ; 30 cm. |
| Bibliography: | Bibliography : leaves 114-117. |