Material characterization of soft solder die attaches for power ICs /
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة كتاب |
| اللغة: | English |
| منشور في: |
1996.
|
| الموضوعات: | |
| الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
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| 001 | u404422 | ||
| 003 | SIRSI | ||
| 008 | 790926s1996 my a t 00 11 eng m | ||
| 035 | |a ACB-6003 | ||
| 040 | |a UMM | ||
| 090 | |a TK7871.15 |b S7Wee | ||
| 091 | |a Microfiche 14918 | ||
| 100 | 1 | 0 | |a Wee, Seng Kee |
| 245 | 1 | 0 | |a Material characterization of soft solder die attaches for power ICs / |c Wee Seng Kee. |
| 260 | |c 1996. | ||
| 300 | |a vii, 118 leaves : |b ill., col. ; |c 30 cm. | ||
| 500 | |a Microfiche. Kuala Lumpur : University of Malaya Library, 2000. 2 fiches : negative ; 11 x 15 cm. | ||
| 502 | |a Dissertation (M.Tech. (Material Sc.)) -- Institut Pengajian Tinggi, Universiti Malaya, 1997. | ||
| 504 | |a Bibliography : leaves 114-117. | ||
| 650 | 0 | |a Solder and soldering. | |
| 650 | 0 | |a Microelectronic packaging. |x Materials. | |
| 710 | 2 | 0 | |a Universiti Malaya. |b Institut Pengajian Tinggi. |
| 948 | |a 26/10/1996 |b 25/09/2003 | ||
| 596 | |a 1 | ||
| 999 | |a TK7871.15 S7WEE |w LC |c 1 |i A505602155 |d 27/4/2015 |e 27/4/2015 |l STACKS |m P01UTAMA |n 1 |r Y |s Y |t TESIS |u 1/11/1996 | ||
| 999 | |a TK7871.15 S7WEE |w LC |c 2 |i A506426353 |d 3/4/2008 |e 3/4/2008 |l B_KOM4 |m P01UTAMA |n 1 |r Y |s Y |t TESIS |u 28/12/1996 |o .PUBLIC. BKOM4: 42614 | ||