An analysis of the epoxy molding compound industry /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
1997.
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| Subjects: | |
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| LEADER | 00855cam a2200253 a 4500 | ||
|---|---|---|---|
| 001 | u407529 | ||
| 003 | SIRSI | ||
| 008 | 970220s1997 si v 00 1 eng m | ||
| 035 | |a ACC-4227 | ||
| 040 | |a UMM | ||
| 090 | |a HD9696 |b S42Chi | ||
| 100 | 1 | 0 | |a Chin, Neep Hing. |
| 245 | 1 | 3 | |a An analysis of the epoxy molding compound industry / |c by Chin Neep Hing. |
| 260 | |c 1997. | ||
| 300 | |a vii, 100 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.B.A.) -- National University of Singapore, 1997. | ||
| 504 | |a Bibliography: leaves 86-88. | ||
| 650 | 0 | |a Semiconductor industry. | |
| 650 | 0 | |a Electronic packaging |x Materials | |
| 650 | 0 | |a Integrated circuits |x Design and construction | |
| 650 | 0 | |a Epoxy resins | |
| 948 | |a 20/02/1997 |b 25/11/2000 | ||
| 596 | |a 1 | ||
| 999 | |a F HD9696 S42CHI |w LC |c 1 |i A506849941 |d 28/2/1998 |l STACKS |m P01UTAMA |n 1 |r Y |s Y |t TESIS |u 29/10/1997 | ||