An analysis of the epoxy molding compound industry /
Saved in:
| Main Author: | Chin, Neep Hing |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
1997.
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
IC design industry in Singapore /
by: Maung, Myint Swe
Published: (1996) -
A study of wire sweep during transfer molding on plastic IC packaging /
by: Wu, Jianhua
Published: (1996) -
Foaming and curing an aqueous epoxy foam using microwave
by: Erny Raudhoh, Mohd Shafie -
Pull-out of aramid fibre from epoxy resin matrics /
by: Ishak Ahmad
Published: (1999) -
Use of wire mesh-epoxy composite for strengthening concrete beams /
by: Qeshta, Ismail M. I.
Published: (2014)
