Wu, J. (1996). A study of wire sweep during transfer molding on plastic IC packaging.
Chicago Style (17th ed.) CitationWu, Jianhua. A Study of Wire Sweep During Transfer Molding on Plastic IC Packaging. 1996.
MLA引文Wu, Jianhua. A Study of Wire Sweep During Transfer Molding on Plastic IC Packaging. 1996.
警告：这些引文格式不一定是100％准确.