A study of wire sweep during transfer molding on plastic IC packaging /
Saved in:
Main Author: | Wu, Jianhua |
---|---|
Format: | Thesis Book |
Language: | English |
Published: |
1996.
|
Subjects: | |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages /
by: Shutesh Krishnan
Published: (2007) -
Package cracking mechanism in plastic encapsulated integrated circuit devices /
by: Tan, Geok Leong
Published: (1993) -
Delamination propagation in plastic IC packages during solder reflow /
by: Ma, Yiyi
Published: (1999) -
Study of alternative packaging materials for semiconductor devices /
by: Suprammaniam, Sugumar
Published: (1997) -
Material characterization of soft solder die attaches for power ICs /
by: Wee, Seng Kee
Published: (1996)