A study of wire sweep during transfer molding on plastic IC packaging /

A study of wire sweep during transfer molding on plastic IC packaging /

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書目詳細資料
主要作者:	Wu, Jianhua
格式:	Thesis 圖書
語言:	English
出版:	1996.
主題:	Integrated circuits > Packaging Electronic packaging > Materials Microelectronic packaging.
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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