APA引文

Chow, S. G. (1996). Thermal analysis of IC components undergoing solder reflow.

Chicago Style (17th ed.) Citation

Chow, Seng Guan. Thermal Analysis of IC Components Undergoing Solder Reflow. 1996.

MLA引文

Chow, Seng Guan. Thermal Analysis of IC Components Undergoing Solder Reflow. 1996.

警告：這些引文格式不一定是100％准確.