Thermal analysis of IC components undergoing solder reflow /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
1996.
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| Subjects: | |
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| LEADER | 00812cam a2200253 a 4500 | ||
|---|---|---|---|
| 001 | u413531 | ||
| 003 | SIRSI | ||
| 008 | 970715s1996 si v 00 1 eng | ||
| 035 | |a ACD-5002 | ||
| 040 | |a UMM | ||
| 090 | |a TJ260 |b Cho | ||
| 100 | 1 | 0 | |a Chow, Seng Guan. |
| 245 | 1 | 0 | |a Thermal analysis of IC components undergoing solder reflow / |c Chow Seng Guan. |
| 260 | |c 1996. | ||
| 300 | |a xiii 145 leaves : |b ill. (some col.) ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Sc.) -- National University of Singapore, 1996. | ||
| 504 | |a Bibliography: leaves 140-145. | ||
| 650 | 0 | |a Heat |x Convection. | |
| 650 | 0 | |a Thermal analysis. | |
| 650 | 0 | |a Integrated circuits. | |
| 650 | 0 | |a Solder and soldering. | |
| 948 | |a 15/07/1997 |b 01/04/1999 | ||
| 596 | |a 1 | ||
| 999 | |a TJ260 CHO |w LC |c 1 |i A506946381 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 6/2/1998 | ||