Thermal analysis of IC components undergoing solder reflow /

Thermal analysis of IC components undergoing solder reflow /

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书目详细资料
主要作者:	Chow, Seng Guan
格式:	Thesis 图书
语言:	English
出版:	1996.
主题:	Heat > Convection. Thermal analysis. Integrated circuits. Solder and soldering.
标签:	添加标签没有标签, 成为第一个标记此记录!

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