Study of alternative packaging materials for semiconductor devices /
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| 主要作者: | |
|---|---|
| 格式: | Thesis 圖書 |
| 語言: | English |
| 出版: |
1997.
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| 001 | u414683 | ||
| 003 | SIRSI | ||
| 008 | 970729s1997 my t 00 1 eng m | ||
| 035 | |a ACD-6907 | ||
| 040 | |a UMM | ||
| 090 | |a TK7874 |b Sup | ||
| 091 | |a Microfiche 14922 | ||
| 100 | 1 | 0 | |a Suprammaniam, Sugumar |
| 245 | 1 | 0 | |a Study of alternative packaging materials for semiconductor devices / |c by Sugumar Suprammaniam. |
| 260 | 0 | |c 1997. | |
| 300 | |a vi, 121 leaves : |b ill., (some col) ; |c 30 cm. | ||
| 500 | |a Microfiche. Kuala Lumpur : University of Malaya Library, 2000. 2 fiches : negative ; 11 x 15 cm. | ||
| 502 | |a Dissertation (M.Tech. (Material Sc.)) -- Institut Pengajian Siswazah dan Penyelidikan, Universiti Malaya, 1997. | ||
| 504 | |a Bibliography : leaves 116-121 | ||
| 650 | 0 | |a Microelectronic packaging. |x Materials. | |
| 650 | 0 | |a Plastics in packaging. | |
| 650 | 0 | |a Thermoplastics. | |
| 710 | 0 | |a Universiti Malaya. |b Institut Pengajian Siswazah dan Penyelidikan. | |
| 948 | |a 14/08/1997 |b 25/09/2003 | ||
| 596 | |a 1 | ||
| 999 | |a TK7874 SUP |w LC |c 1 |i A505607696 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 21/8/1997 | ||
| 999 | |a TK7874 SUP |w LC |c 2 |i A505995651 |l B_KOM4 |m P01UTAMA |r Y |s Y |t TESIS |u 26/8/1997 |o .PUBLIC. BKOM 4 : 42612 | ||