Development of non-post mold cure alternative for semiconductor packaging /
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة كتاب |
| اللغة: | English |
| منشور في: |
1997.
|
| الموضوعات: | |
| الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
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| 001 | u414698 | ||
| 003 | SIRSI | ||
| 008 | 970729s1997 my t 00 1 eng m | ||
| 035 | |a ACD-6926 | ||
| 040 | |a UMM | ||
| 090 | |a TK7874 |b Tan | ||
| 091 | |a Microfiche 14923 | ||
| 100 | 1 | 0 | |a Tan, Sook Wai |
| 245 | 1 | 0 | |a Development of non-post mold cure alternative for semiconductor packaging / |c by Tan Sook Wai. |
| 260 | 0 | |c 1997. | |
| 300 | |a vii, 98 leaves : |b ill. ; |c 30 cm. | ||
| 500 | |a Microfiche. Kuala Lumpur : University of Malaya Library, 2000. 2 fiches : negative ; 11 x 15 cm. | ||
| 502 | |a Dissertation (M. Tech.(Material. Sc.)) -- Institut Pengajian Siswazah dan Penyelidikan, Universiti Malaya, 1997. | ||
| 504 | |a Bibliography : leaves 97-98 | ||
| 650 | 0 | |a Microelectronic packaging. | |
| 650 | 0 | |a Electronic apparatus and appliances |x Plastic embedment. | |
| 650 | 0 | |a Epoxy resins |x Curing. | |
| 710 | 0 | |a Universiti Malaya. |b Institut Pengajian Siswazah dan Penyelidikan. | |
| 948 | |a 14/08/1997 |b 25/09/2003 | ||
| 596 | |a 1 | ||
| 999 | |a TK7874 TAN |w LC |c 1 |i A505607712 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 21/8/1997 | ||
| 999 | |a TK7874 TAN |w LC |c 2 |i A505995713 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 26/8/1997 | ||