3D visual inspection of IC bonding wires /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
1997.
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| Subjects: | |
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| LEADER | 00751cam a2200241 a 4500 | ||
|---|---|---|---|
| 001 | u425364 | ||
| 003 | SIRSI | ||
| 008 | 980616s1997 si v 00 1 eng m | ||
| 035 | |a ACF-2704 | ||
| 040 | |a UMM | ||
| 090 | |a TA1637 |b Han | ||
| 100 | 1 | 0 | |a Han, Xiao |
| 245 | 1 | 0 | |a 3D visual inspection of IC bonding wires / |c by Han Xiao. |
| 260 | |c 1997. | ||
| 300 | |a vii, 103 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Eng.) -- National University of Singapore, 1997. | ||
| 504 | |a Bibliography: leaves 98-103. | ||
| 650 | 0 | |a Image processing. | |
| 650 | 0 | |a Integrated circuits |x Testing. | |
| 650 | 0 | |a Metal bonding |x Testing | |
| 948 | |a 16/06/1998 |b 25/11/2000 | ||
| 596 | |a 1 | ||
| 999 | |a TA1637 HAN |w LC |c 1 |i A507918801 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 23/7/1998 | ||