Sea of contact process to solve bondpad peeling /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
1998.
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| Subjects: | |
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| LEADER | 00691cam a2200217 a 4500 | ||
|---|---|---|---|
| 001 | u434798 | ||
| 003 | SIRSI | ||
| 008 | 990202s1998 si v 00 1 eng m | ||
| 035 | |a ACG-5521 | ||
| 040 | |a UMM | ||
| 090 | |a QC611.6 |b D4Won | ||
| 100 | 1 | 0 | |a Wong, Ching Fat. |
| 245 | 1 | 0 | |a Sea of contact process to solve bondpad peeling / |c by Wong Ching Fat. |
| 260 | |c 1998. | ||
| 300 | |a ix, 59 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Sc.) -- National University of Singapore, 1998. | ||
| 650 | 0 | |a Semiconductors |x Defects. | |
| 650 | 0 | |a Semiconductors |x Bonding | |
| 948 | |a 02/02/1999 |b 14/04/1999 | ||
| 596 | |a 1 | ||
| 999 | |a QC611.6 D4WON |w LC |c 1 |i A508375182 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 22/4/1999 | ||