APA引文

Lin, T. (1999). Hygrothermally-induced delamination and cracking in plastic IC packages.

Chicago Style (17th ed.) Citation

Lin, Tingyu. Hygrothermally-induced Delamination and Cracking in Plastic IC Packages. 1999.

MLA引文

Lin, Tingyu. Hygrothermally-induced Delamination and Cracking in Plastic IC Packages. 1999.

警告：这些引文格式不一定是100％准确.