Hygrothermally-induced delamination and cracking in plastic IC packages /
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| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
1999.
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| Subjects: | |
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| LEADER | 00764cam a2200229 a 4500 | ||
|---|---|---|---|
| 001 | u448818 | ||
| 003 | SIRSI | ||
| 008 | 991117s1999 si v 00 eng | ||
| 035 | |a ACI-5275 | ||
| 040 | |a UMM | ||
| 090 | |a TS198.3 |b P5Lin | ||
| 100 | 1 | 0 | |a Lin, Tingyu. |
| 245 | 1 | 0 | |a Hygrothermally-induced delamination and cracking in plastic IC packages / |c by Lin Tingyu. |
| 260 | |c 1999. | ||
| 300 | |a xxv, 218 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Thesis (Ph.D.) -- National University of Singapore, 1999. | ||
| 504 | |a Bibliography: leaves 204-218. | ||
| 650 | 0 | |a Plastics in packaging |x Fracture | |
| 650 | 0 | |a Plastics |x Permeability |x Testing | |
| 948 | |a 10/12/1999 |b 25/02/2000 | ||
| 596 | |a 1 | ||
| 999 | |a TS198.3 P5LIN |w LC |c 1 |i A509205023 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 18/4/2000 | ||