APA (7th ed.) Citation

Ma, Y. (1999). Delamination propagation in plastic IC packages during solder reflow.

Chicago Style (17th ed.) Citation

Ma, Yiyi. Delamination Propagation in Plastic IC Packages During Solder Reflow. 1999.

MLA (8th ed.) Citation

Ma, Yiyi. Delamination Propagation in Plastic IC Packages During Solder Reflow. 1999.

Warning: These citations may not always be 100% accurate.