APA引文

Ma, Y. (1999). Delamination propagation in plastic IC packages during solder reflow.

Chicago Style (17th ed.) Citation

Ma, Yiyi. Delamination Propagation in Plastic IC Packages During Solder Reflow. 1999.

MLA引文

Ma, Yiyi. Delamination Propagation in Plastic IC Packages During Solder Reflow. 1999.

警告：这些引文格式不一定是100％准确.