Delamination propagation in plastic IC packages during solder reflow /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
1999.
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| Subjects: | |
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| LEADER | 00939cam a2200253 a 4500 | ||
|---|---|---|---|
| 001 | u452460 | ||
| 003 | SIRSI | ||
| 008 | 000310s1999 si v 00 1 eng m | ||
| 035 | |a ACJ-0786 | ||
| 040 | |a UMM | ||
| 090 | |a TJ7 |b NUS 1999 Ma | ||
| 100 | 1 | 0 | |a Ma, Yiyi. |
| 245 | 1 | 0 | |a Delamination propagation in plastic IC packages during solder reflow / |c Ma Yiyi. |
| 260 | |c 1999. | ||
| 300 | |a xi, 130 leaves : |b ill. ; |c 30 cm. | ||
| 500 | |a Spine title: Delam. prop. in plastic IC packages during solder reflow. | ||
| 502 | |a Dissertation (M.Eng.) -- National University of Singapore, 1999. | ||
| 504 | |a Bibliography: leaves 123-130. | ||
| 650 | 0 | |a Plastics in packaging |x Fracture | |
| 650 | 0 | |a Electronic packaging. | |
| 740 | 0 | 0 | |a Delam. prop. in plastic IC packages during solder reflow. |
| 948 | |a 11/03/2000 |b 18/11/2002 | ||
| 596 | |a 1 | ||
| 999 | |a TJ7 NUS 1999 MA |w LC |c 1 |i A509515680 |l B_KOM4 |m P01UTAMA |r Y |s Y |t TESIS |u 29/11/2002 |o .PUBLIC. BKOM 4 : 45045 | ||