APA (7th ed.) Citation

Ng, W. C. (1999). Zincation pretreatment for electroless nickel underbump metallurgy in microelectronics packaging.

Chicago Style (17th ed.) Citation

Ng, Wei Chin. Zincation Pretreatment for Electroless Nickel Underbump Metallurgy in Microelectronics Packaging. 1999.

MLA (8th ed.) Citation

Ng, Wei Chin. Zincation Pretreatment for Electroless Nickel Underbump Metallurgy in Microelectronics Packaging. 1999.

Warning: These citations may not always be 100% accurate.