APA引文

Ng, W. C. (1999). Zincation pretreatment for electroless nickel underbump metallurgy in microelectronics packaging.

Chicago Style (17th ed.) Citation

Ng, Wei Chin. Zincation Pretreatment for Electroless Nickel Underbump Metallurgy in Microelectronics Packaging. 1999.

MLA引文

Ng, Wei Chin. Zincation Pretreatment for Electroless Nickel Underbump Metallurgy in Microelectronics Packaging. 1999.

警告：這些引文格式不一定是100％准確.