Zincation pretreatment for electroless nickel underbump metallurgy in microelectronics packaging /
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
1999.
|
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| LEADER | 00732cam a2200205 a 4500 | ||
|---|---|---|---|
| 001 | u476912 | ||
| 003 | SIRSI | ||
| 008 | 000929s1999 si v 00 1 eng m | ||
| 035 | |a ACO-1494 | ||
| 040 | |a UMM | ||
| 090 | |a TD7 |b NUS 1999 Ng | ||
| 100 | 1 | 0 | |a Ng, Wei Chin. |
| 245 | 1 | 0 | |a Zincation pretreatment for electroless nickel underbump metallurgy in microelectronics packaging / |c by Ng Wei Chin. |
| 260 | |c 1999. | ||
| 300 | |a vii, 132 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Eng.) -- National University of Singapore, 1999. | ||
| 504 | |a Bibliography: leaves 126-130. | ||
| 948 | |a 22/02/2001 |b 31/10/2002 | ||
| 596 | |a 1 | ||
| 999 | |a TD7 NUS 1999 NG |w LC |c 1 |i A510138611 |l B_KOM4 |m P01UTAMA |r Y |s Y |t TESIS |u 11/11/2002 |o .PUBLIC. BKOM 4 : 44964 | ||