Integration of Cu interconnects for sub-0.25 um manufacturing /

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Bibliographic Details
Main Author: Yap, Kuan Pei
Format: Thesis Book
Language:English
Published: 1999.
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008 010220s1999 si a v 00 10 eng m
035 |a ACO-1598 
040 |a UMM 
090 |a TA403  |b NUS 1999 Yap 
100 1 0 |a Yap, Kuan Pei. 
245 1 0 |a Integration of Cu interconnects for sub-0.25 um manufacturing /  |c Yap Kuan Pei. 
260 |c 1999. 
300 |a xii, 127 leaves :  |b ill. ;  |c 30 cm. 
502 |a Dissertation (M.Sc.) -- National University of Singapore, 1999. 
504 |a Includes bibliographical references. 
948 |a 22/02/2001  |b 12/11/2002 
596 |a 1 
999 |a TA403 NUS 1999 YAP  |w LC  |c 1  |i A510063157  |l B_KOM4  |m P01UTAMA  |r Y  |s Y  |t TESIS  |u 12/11/2002  |o .PUBLIC. BKOM 4 : 45174