APA (7th ed.) Citation

Tengku Elisa Bustaman. (1999). Analysis of foreign matter materials related to the die attach process of semiconductor device packaging.

Chicago Style (17th ed.) Citation

Tengku Elisa Bustaman. Analysis of Foreign Matter Materials Related to the Die Attach Process of Semiconductor Device Packaging. 1999.

MLA (8th ed.) Citation

Tengku Elisa Bustaman. Analysis of Foreign Matter Materials Related to the Die Attach Process of Semiconductor Device Packaging. 1999.

Warning: These citations may not always be 100% accurate.