APA引文

Tengku Elisa Bustaman. (1999). Analysis of foreign matter materials related to the die attach process of semiconductor device packaging.

Chicago Style (17th ed.) Citation

Tengku Elisa Bustaman. Analysis of Foreign Matter Materials Related to the Die Attach Process of Semiconductor Device Packaging. 1999.

MLA引文

Tengku Elisa Bustaman. Analysis of Foreign Matter Materials Related to the Die Attach Process of Semiconductor Device Packaging. 1999.

警告：這些引文格式不一定是100％准確.