Analysis of foreign matter materials related to the die attach process of semiconductor device packaging /
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة كتاب |
| اللغة: | English |
| منشور في: |
1999.
|
| الموضوعات: | |
| الوصول للمادة أونلاين: | http://studentsrepo.um.edu.my/id/eprint/2859 |
| الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
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| 008 | 970729s1999 my t 00 1 eng m | ||
| 035 | |a ACO-2896 | ||
| 040 | |a UMM | ||
| 090 | |a TA403 |b UM 1999 Teneb | ||
| 100 | 0 | |a Tengku Elisa Bustaman. | |
| 245 | 1 | 0 | |a Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / |c Tengku Elisa Bustaman. |
| 260 | 0 | |c 1999. | |
| 300 | |a iv, 134 leaves : |b ill., (some col.) ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Tech. (Material Sc.)) -- Institut Pengajian Siswazah dan Penyelidikan, Universiti Malaya, 2001. | ||
| 504 | |a Bibliography : leaves 85-86 | ||
| 650 | 0 | |a Semiconductors. | |
| 710 | 2 | 0 | |a Universiti Malaya. |b Institut Pengajian Siswazah dan Penyelidikan. |
| 856 | 4 | 1 | |u http://studentsrepo.um.edu.my/id/eprint/2859 |
| 948 | |a 01/03/2001 |b 25/09/2003 | ||
| 596 | |a 1 | ||
| 999 | |a TA403 UM 1999 TENEB |w LC |c 1 |i A509844959 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 15/3/2001 |o .PUBLIC. BKOM 4 :43062 | ||
| 999 | |a TA403 UM 1999 TENEB |w LC |c 2 |i A510145443 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 24/3/2001 | ||