Investigation of the quality and reliability of copper interconnects /
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
2000.
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| LEADER | 00806cam a2200241 a 4500 | ||
|---|---|---|---|
| 001 | u503651 | ||
| 003 | SIRSI | ||
| 008 | 000929s2000 si v 00 1 eng m | ||
| 035 | |a ACV-5835 | ||
| 040 | |a UMM | ||
| 090 | |a TK7 |b NUS 2000 Koh | ||
| 100 | 1 | 0 | |a Koh, Leong Tee |
| 245 | 1 | 0 | |a Investigation of the quality and reliability of copper interconnects / |c by Koh Leong Tee. |
| 260 | |c 2000. | ||
| 300 | |a xii, 90 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Sc.) -- National University of Singapore, 2000. | ||
| 504 | |a Bibliography: leaves 84-90. | ||
| 650 | 0 | |a Electronic packaging. | |
| 650 | 0 | |a Semiconductors |x Junctions. | |
| 900 | |a NHS | ||
| 948 | |a 27/08/2002 |b 09/11/2002 | ||
| 596 | |a 1 | ||
| 999 | |a TK7 NUS 2000 KOH |w LC |c 1 |i A510553154 |l B_KOM4 |m P01UTAMA |r Y |s Y |t TESIS |u 18/11/2002 |o .PUBLIC. BKOM 4 : 45466 | ||