A resistance-noise model for the investigation of interconnect voiding and reliability /

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Bibliographic Details
Main Author: Chu, Lip Wei
Format: Thesis Book
Language:English
Published: 2001.
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100 1 0 |a Chu, Lip Wei. 
245 1 2 |a A resistance-noise model for the investigation of interconnect voiding and reliability /  |c Chi Lip Wei. 
260 |c 2001. 
300 |a xii, 126 leaves :  |b ill. ;  |c 30 cm. 
502 |a Dissertation (M.Eng.) -- National University of Singapore, 2001. 
504 |a Bibliography: leaves 121-125. 
948 |a 26/11/2002  |b 28/11/2002 
596 |a 1 
999 |a TK7 NUS 2001 CHU  |w LC  |c 1  |i A510652181  |l B_KOM4  |m P01UTAMA  |r Y  |s Y  |t TESIS  |u 24/12/2002  |o .PUBLIC. BKOM 4 : 45333