Surface modification and metallization of a polyimide for microelectronic package /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2001.
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| LEADER | 00713nam a2200205 a 4500 | ||
|---|---|---|---|
| 001 | u507043 | ||
| 003 | SIRSI | ||
| 008 | 021126s2001 si a v 00 10 eng m | ||
| 035 | |a ACW-4885 | ||
| 040 | |a UMM | ||
| 090 | |a TP7 |b NUS 2001 Yu | ||
| 100 | 1 | 0 | |a Yu, Weixing. |
| 245 | 1 | 0 | |a Surface modification and metallization of a polyimide for microelectronic package / |c Yu Weixing. |
| 260 | |c 2001. | ||
| 300 | |a xiii, 127 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Eng.) -- National University of Singapore, 2001. | ||
| 504 | |a Bibliography: leaves 122-127. | ||
| 948 | |a 26/11/2002 |b 26/11/2002 | ||
| 596 | |a 1 | ||
| 999 | |a TP7 NUS 2001 YU |w LC |c 1 |i A510669879 |l B_KOM4 |m P01UTAMA |r Y |s Y |t TESIS |u 24/12/2002 |o .PUBLIC. bkom 4 : 43321 | ||