APA (7th ed.) Citation

Koh Sau Wee. (2002). A new methodology for modeling vapour pressure development during solder reflow in IC packages.

Chicago Style (17th ed.) Citation

Koh Sau Wee. A New Methodology for Modeling Vapour Pressure Development During Solder Reflow in IC Packages. 2002.

MLA (8th ed.) Citation

Koh Sau Wee. A New Methodology for Modeling Vapour Pressure Development During Solder Reflow in IC Packages. 2002.

Warning: These citations may not always be 100% accurate.