APA引文

Koh Sau Wee. (2002). A new methodology for modeling vapour pressure development during solder reflow in IC packages.

Chicago Style (17th ed.) Citation

Koh Sau Wee. A New Methodology for Modeling Vapour Pressure Development During Solder Reflow in IC Packages. 2002.

MLA引文

Koh Sau Wee. A New Methodology for Modeling Vapour Pressure Development During Solder Reflow in IC Packages. 2002.

警告：這些引文格式不一定是100％准確.