Study of interconnect reliability in BGA packging /

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Bibliographic Details
Main Author: Seah, Simon Kah Woon
Format: Thesis Book
Language:English
Published: 2002.
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040 |a UMM 
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100 1 0 |a Seah, Simon Kah Woon 
245 1 0 |a Study of interconnect reliability in BGA packging /  |c Seah Kah Woon Simon. 
260 |c 2002. 
300 |a ix, 92, A-21 leaves :  |b ill. ;  |c 30 cm. 
502 |a Dissertation (M.Eng.) -- National University of Singapore, 2002. 
504 |a Bibliography: leaves 90-92. 
948 |a 01/03/2004  |b 01/03/2004 
596 |a 1 
999 |a TJ7 NUS 2002 SEA  |w LC  |c 1  |i A511201273  |l B_KOM4  |m P01UTAMA  |r Y  |s Y  |t TESIS  |u 12/3/2004  |o .PUBLIC. BKOM 4 : 45853