Improvement on the ball attach process of BGA packages /
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| 主要作者: | |
|---|---|
| 格式: | Thesis 圖書 |
| 語言: | English |
| 出版: |
1999
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| LEADER | 00822cam a2200229 i 4500 | ||
|---|---|---|---|
| 001 | u687183 | ||
| 003 | SIRSI | ||
| 008 | 910820s1999 my m 00 1 eng m | ||
| 035 | |a ACP-2984 | ||
| 040 | |a UMJ |e rda | ||
| 097 | |a TJ7 |b UM 1999 Thi | ||
| 100 | 0 | 0 | |a Thiaga Rajan Muthusamy |
| 245 | 1 | 0 | |a Improvement on the ball attach process of BGA packages / |c Thiaga Rajan Muthusamy |
| 260 | 1 | |c 1999 | |
| 300 | |a iv, 60 leaves : |b ill. ; |c 28 cm. | ||
| 502 | |a Dissertation (M.Eng.Sc.) -- Fakulti Kejuruteraan, Universiti Malaya, 1999. | ||
| 650 | 0 | |a Ball grid array technology | |
| 650 | 0 | |a Microelectronic packaging | |
| 710 | 2 | 0 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik. |
| 948 | |a 18/05/2001 |b 25/02/2002 | ||
| 596 | |a 7 | ||
| 999 | |a TJ7 UM 1999 THI |w LC |c 1 |i A511881904 |d 7/8/2008 |f 7/8/2008 |g 1 |l STACKS |m P07JURUTER |r Y |s Y |t TESIS |u 31/7/2008 | ||