Improvement on the ball attach process of BGA packages /

Improvement on the ball attach process of BGA packages /

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书目详细资料
主要作者:	Thiaga Rajan Muthusamy
格式:	Thesis 图书
语言:	English
出版:	1999
主题:	Ball grid array technology Microelectronic packaging
标签:	添加标签没有标签, 成为第一个标记此记录!

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